Patent · US Active

Split core circuit module

US7522421B2 · kind B2 · utility

6Cited by
271References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 13, 2007
Grant dateApr 21, 2009
Priority date
Expiry dateJul 13, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/1572
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A rigid substrate configured with wings diverging from a central axis to create, preferably, a ‘V’-shaped structure provide supportive structure for the populated flex circuitry that is wrapped about an edge of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.