Entorian Technologies, Inc
🏢 View company profile →46Patents
32Active
46Granted
47Portfolio score
Filing activity: May 9, 2003 → Nov 18, 2009 · 32 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8341311B1 | System and method for reduced latency data transfers from flash memory to host by utilizing concurrent transfers into RAM buffer memory and FIFO host interface | Physics | 52 | Active |
| US7595550B2 | Flex-based circuit module | Electricity | 29 | Expired |
| US7616452B2 | Flex circuit constructions for high capacity circuit module systems and methods | Electricity | 25 | Active |
| US7443023B2 | High capacity thin module system | Electricity | 19 | Active |
| US7606042B2 | High capacity thin module system and method | Electricity | 17 | Active |
| US7446410B2 | Circuit module with thermal casing systems | Electricity | 15 | Active |
| US7417310B2 | Circuit module having force resistant construction | Electricity | 14 | Active |
| US7626259B2 | Heat sink for a high capacity thin module system | Electricity | 12 | Active |
| US7719098B2 | Stacked modules and method | Emerging Cross-Sectional Technologies | 10 | Active |
| US7579687B2 | Circuit module turbulence enhancement systems and methods | Electricity | 9 | Active |
| US7423885B2 | Die module system | Electricity | 9 | Expired |
| US7468553B2 | Stackable micropackages and stacked modules | Electricity | 9 | Active |
| US7508723B2 | Buffered memory device | Physics | 8 | Active |
| US7760513B2 | Modified core for circuit module system and method | Electricity | 7 | Active |
| US7602613B2 | Thin module system and method | Electricity | 7 | Active |
| US7576995B2 | Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area | Emerging Cross-Sectional Technologies | 6 | Active |
| US7804985B2 | Circuit module having force resistant construction | Electricity | 6 | Active |
| US7522421B2 | Split core circuit module | Electricity | 6 | Active |
| US7459784B2 | High capacity thin module system | Electricity | 6 | Active |
| US7480152B2 | Thin module system and method | Electricity | 6 | Expired |
| US7511968B2 | Buffered thin module system and method | Electricity | 5 | Expired |
| US7606049B2 | Module thermal management system and method | Electricity | 4 | Active |
| US7606050B2 | Compact module system and method | Electricity | 4 | Expired |
| US7524703B2 | Integrated circuit stacking system and method | Electricity | 4 | Expired |
| US7468893B2 | Thin module system and method | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.