Thermal processing apparatus, thermal processing method, and substrate processing apparatus
US7522823B2 · kind B2 · utility
16Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2004 |
| Grant date | Apr 21, 2009 |
| Priority date | — |
| Expiry date | Aug 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a thermal processing unit, a substrate is held by a local transport hand to be transported between a transfer section and a heating unit, and subjected to a heat processing by the heating unit. Also, the local transport hand is cooled by a cooling plate in the transfer section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.