Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films
US7524594B2 · kind B2 · utility
11Cited by
28References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2005 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | May 27, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/106
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.