Robert A. Shick
26Patents
11h-index
52Co-inventors
78Inventor score
Filing activity: May 25, 1995 → Aug 12, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6136499A | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups | Emerging Cross-Sectional Technologies | 64 | Expired |
| US6790579B1 | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups | Emerging Cross-Sectional Technologies | 62 | Expired |
| US6232417A | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups | Emerging Cross-Sectional Technologies | 55 | Expired |
| US5912313A | Addition polymers of polycycloolefins containing silyl functional groups | Chemistry; Metallurgy | 41 | Expired |
| US6723486B2 | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6538087B2 | Polymeric compositions for forming optical waveguides; optical waveguides formed therefrom; and methods for making same | Physics | 22 | Expired |
| US6121340A | Photodefinable dielectric compositions comprising polycyclic polymers | Physics | 22 | Expired |
| US6677175B2 | Optical waveguides and methods for making the same | Physics | 17 | Expired |
| US7851575B2 | Polycyclic polymers containing pendant ion conducting moieties | Emerging Cross-Sectional Technologies | 14 | Active |
| US6031058A | Addition polymers of polycycloolefins containing silyl functional groups | Chemistry; Metallurgy | 13 | Expired |
| US7524594B2 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6147177A | Polycyclic resist compositions with increased etch resistance | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6294616A | Blends and alloys of polycyclic polymers | Chemistry; Metallurgy | 10 | Expired |
| US7932161B2 | Methods and materials useful for chip stacking, chip and wafer bonding | Electricity | 10 | Active |
| US7312292B2 | Polycyclic polymers containing pendant ion conducting moieties | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6451499B1 | Polycyclic resist compositions with increased etch resistance | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6649707B1 | Blends and alloys of polycyclic polymers | Chemistry; Metallurgy | 7 | Expired |
| US8053515B2 | Directly photodefinable polymer compositions and methods thereof | Physics | 4 | Active |
| US8120168B2 | Methods and materials useful for chip stacking, chip and wafer bonding | Electricity | 3 | Active |
| US8030425B2 | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films | Physics | 3 | Active |
| US8729215B2 | Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers | Chemistry; Metallurgy | 2 | Active |
| US7378456B2 | Directly photodefinable polymer compositions and methods thereof | Physics | 2 | Expired |
| US7858721B2 | Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films | Physics | 1 | Active |
| US8816485B2 | Methods and materials useful for chip stacking, chip and wafer bonding | Electricity | 1 | Active |
| US8575297B2 | Sacrificial polymer compositions including polycarbonates having repeat units derived from stereospecific polycyclic 2,3-diol monomers | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.