Method for manufactuing a semiconductor integrated circuit device
US7524697B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2005 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A burn-in process for a semiconductor integrated circuit device includes a first process of positioning bump electrodes of the semiconductor integrated circuit device with respect to pads of a socket having detachment mechanisms, a second process of pressing the bump electrodes against the pads by weighting the semiconductor integrated circuit device, and a third process of detaching the bump electrodes from the pads by exerting force on the semiconductor integrated circuit device in a direction opposite to a weighting direction of the second process. Automatic insertion and detachment of a semiconductor integrated circuit chip in a burn-in test is facilitated by detaching the bump electrodes from the pads by pushing up the semiconductor integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.