Substrate processing method using alkaline solution and acid solution
US7524771B2 · kind B2 · utility
10Cited by
13References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2003 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Oct 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Particles adhering to the surface of a substrate are removed by physical action of injection of droplets or megasonic vibrations or by combination of the physical action and slight etching on the surface of the substrate. On the other hand, metal contaminants adhering to the surface of the substrate are altered to hydroxides with an alkaline solution and thereafter dissolved with an acid solution to be removed. Thus, it is possible to rapidly process the substrate while minimizing the quantity of etching on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.