Submount for light emitting diode and its manufacturing method
US7525124B2 · kind B2 · utility
2Cited by
3References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 9, 2005 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Oct 30, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
Abstract
A submount for a light emitting diode and its manufacturing method, the submount including a reflector and having a compact size. The submount for the light emitting diode comprises a Si base substrate having input/output terminals formed on a front side thereof, and a Si reflector having a sloped through hole and a reflecting film formed at least on a slope defining the through hole. The Si reflector is mounted on the Si base substrate and is fixedly joined to the Si base substrate. The Si reflector and the Si base substrate are joined to each other by a thin film solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.