Heat dissipating device with preselected designed interface for thermal interface materials
US7527090B2 · kind B2 · utility
15Cited by
46References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2003 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Nov 13, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.