Package for a light emitting element with integrated electrostatic discharge protection
US7528422B2 · kind B2 · utility
41Cited by
10References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 20, 2006 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Sep 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes a substrate with a recess in which a light emitting element is mounted. A surface of the substrate forms an exterior surface of the package. A lid may be attached to the substrate to define a sealed region in which the light emitting element is mounted. The lid is transparent to a wavelength of light emitted by the light emitting element. Electrostatic discharge protection circuitry in the substrate is electrically coupled to the light emitting element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.