Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
US7528476B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Mar 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a semiconductor substrate having an active surface and a back surface; an integrated circuit formed on the active surface; a feedthrough electrode penetrating the semiconductor substrate, and projecting from the active surface and the back surface; a first resin layer formed on the active surface, having a thickness greater than a height of a portion of the feedthrough electrode that projects from the active surface, and having an opening portion for exposing at least a portion of the feedthrough electrode; a wiring layer which is formed on the first resin layer, and which is connected to the feedthrough electrode through the opening portion; and an external connecting terminal connected to the wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.