Surface acoustic wave device, package for the device, and method of fabricating the device
US7528522B2 · kind B2 · utility
3Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2004 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Jul 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device includes a package having a cavity, a SAW chip housed in the cavity, a resin sealing the cavity, and a metal thin film provided on the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.