Power semiconductor module and method for cooling a power semiconductor module
US7529091B2 · kind B2 · utility
2Cited by
23References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | May 24, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f) is arranged between at least two cells.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.