Semiconductor device and method of fabricating the same
US7529147B2 · kind B2 · utility
6Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 2, 2006 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Nov 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor device has a semiconductor substrate; an electric fuse provided on the semiconductor substrate, and having a first fuse link and a second fuse link connected in series; and a terminal provided between the first fuse link and the second fuse link, wherein the first fuse link and the second fuse link are configured as being different from each other in current value necessary for blowing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.