Socket and method for compensating for differing coefficients of thermal expansion
US7530853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2007 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Oct 1, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.