Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7530880B2 · kind B2 · utility
46Cited by
19References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2005 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Oct 5, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.