Inventor · Fremont, CA, US

Rajeev Bajaj

113Patents
25h-index
120Co-inventors
93Inventor score

Filing activity: Dec 26, 1996 → Oct 5, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6001730A Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers Electricity 233 Expired
US5897375A Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture Chemistry; Metallurgy 190 Expired
US6068539A Wafer polishing device with movable window Performing Operations; Transporting 117 Expired
US6254459A Wafer polishing device with movable window Performing Operations; Transporting 86 Expired
US6537144B1 Method and apparatus for enhanced CMP using metals having reductive properties Electricity 64 Expired
US6602724B2 Chemical mechanical polishing of a metal layer with polishing rate monitoring Physics 57 Expired
US9067299B2 Printed chemical mechanical polishing pad Performing Operations; Transporting 53 Active
US7530880B2 Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor Performing Operations; Transporting 46 Expired
US7846008B2 Method and apparatus for improved chemical mechanical planarization and CMP pad Performing Operations; Transporting 46 Active
US9457520B2 Apparatus for printing a chemical mechanical polishing pad Performing Operations; Transporting 45 Active
US5916011A Process for polishing a semiconductor device substrate Performing Operations; Transporting 44 Expired
US9744724B2 Apparatus for printing a chemical mechanical polishing pad Performing Operations; Transporting 41 Active
US7815778B2 Electro-chemical mechanical planarization pad with uniform polish performance Performing Operations; Transporting 39 Active
US8075745B2 Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance Performing Operations; Transporting 39 Active
US8066555B2 Polishing pad Performing Operations; Transporting 39 Active
US6569349B1 Additives to CMP slurry to polish dielectric films Electricity 38 Expired
US5899745A Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor Electricity 37 Expired
US9873180B2 CMP pad construction with composite material properties using additive manufacturing processes Performing Operations; Transporting 37 Active
US8177603B2 Polishing pad composition Performing Operations; Transporting 36 Active
US8292692B2 Polishing pad with endpoint window and systems and method using the same Performing Operations; Transporting 36 Active
US6001726A Method for using a conductive tungsten nitride etch stop layer to form conductive interconnects and tungsten nitride contact structure Electricity 30 Expired
US9296085B2 Polishing pad with homogeneous body having discrete protrusions thereon Performing Operations; Transporting 30 Active
US6506097B1 Optical monitoring in a two-step chemical mechanical polishing process Electricity 27 Expired
US6561873B2 Method and apparatus for enhanced CMP using metals having reductive properties Electricity 27 Expired
US6261157A Selective damascene chemical mechanical polishing Electricity 26 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.