Process for forming integrated circuit comprising copper lines
US7531447B2 · kind B2 · utility
0Cited by
11References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 6, 2005 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Jan 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes copper lines, wherein the crystal structure of the copper has a greater than 30% <001 > crystal orientation and a less than 20% <111> crystal orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.