Method and system for an improved package substrate for use with a semiconductor package
US7531751B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2005 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | May 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for a structure for a package substrate for use in a semiconductor package are disclosed. Package substrates formed according to the systems and methods of the present invention may exhibit improved signal integrity and quality. In order to achieve this increase signal integrity, these systems and methods may endeavor to obtain equalization, or matching, of impedances in signal traces in or on the package substrate by removing material from one or more layers of a package substrate in a region of high signal density. Removing material from these layers may serve to increase the impedance of a signal trace within a region of high signal density such that the impedance of the signal trace with the region of high signal density is substantially matched to the impedance of the signal trace outside the region of high-signal density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.