Patent · US Active

Integrated circuit package and method of manufacture thereof

US7531895B2 · kind B2 · utility

0Cited by

9References

14Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Bernhard Lange · Gerolzhofen, DE
William D. Boyd · Oviedo, US

Key dates

Filing date	Oct 25, 2006
Grant date	May 12, 2009
Priority date	—
Expiry date	Dec 22, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10871
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.