Non-Circular via holes for bumping pads and related structures
US7531898B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2005 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Nov 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device may include a substrate, a conductive pad on a surface of the substrate, and a conductive line on the surface of the substrate. Moreover, the conductive line may be connected to the conductive pad, and the conductive line may be narrow relative to the conductive pad. In addition, an insulating layer may be provided on the substrate, on the conductive line, and on edge portions of the conductive pad. The insulating layer may have a hole therein exposing a central portion of the conductive pad, and a first segment of a perimeter of the hole may substantially define an arc of a circle around the central portion of the conductive pad. A second segment of the perimeter of the hole may substantially deviate from the circle around the central portion of the conductive pad, and the second segment of the perimeter of the hole may be adjacent a connection between the conductive line and the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.