Packaging method for circuit board
US7533457B2 · kind B2 · utility
4Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Jun 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.