Patent · US Active

Plating using copolymer

US7534555B2 · kind B2 · utility

1Cited by

11References

27Claims

0Family size

Assignee

Hitachi Global Storage Technologies Netherlands B.V. · NL

Inventors

Daniel Wayne Bedell · San Jose, US
Gregory Breyta · San Jose, US
Tom Harris · Toronto, CA
April Hixson-Goldsmith · San Jose, US
Murali Ramasubramanian · Fremont, US
Alfred Renaldo · San Jose, US
Benjamin Wang · Cambridge, US

Key dates

Filing date	Dec 10, 2003
Grant date	May 19, 2009
Priority date	—
Expiry date	Oct 26, 2026

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/085
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Method of plating using a polymeric barrier layer including a polyphenolic polymer which has a repeating unit of the formula:wherein R1, R2, R3, R4, and R5 are individually hydrogen, a hydroxy group or an azo dye.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.