Method for circuits inspection and method of the same
US7534632B2 · kind B2 · utility
27Cited by
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15Claims
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Assignee
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Key dates
| Filing date | Feb 20, 2007 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Feb 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/161
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for circuit inspection comprises steps of providing a substrate having a conductive line; and forming a metal layer on at least the conductive layer to increase a contrast between the conductive layer and adjacent area for the circuit inspection. The method further comprising removing the metal layer. The metal layer is removed by a mixture of nitric acid, hydrogen peroxide and fluoride boric acid. The metal includes Silver, Nickel or Tin. The deposit metal can be removed by inter diffusion and form intermetallic compounds (for example Cu6Sn5) into the under laying conducting line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.