Microelectronic elements with compliant terminal mountings and methods for making the same
US7534652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2005 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Feb 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps and terminals may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts which extend above a surrounding solder mask layer to facilitate engagement with a test fixture. The posts are immersed within solder joints when the structure is bonded to a circuit panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.