Patent · US Expired

Micromachined thermal mass flow sensors and insertion type flow meters and manufacture methods

US7536908B2 · kind B2 · utility

11Cited by
7References
34Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 21, 2005
Grant dateMay 26, 2009
Priority date
Expiry dateJun 21, 2025

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01F1/68
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation <100>. This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed. Before backside etching the bulk silicon, rectangular openings are formed on the dielectric thin-film layers by applying a plasma etching to separate the area of heater and sensing elements from the rest of the membrane. This mass flow sensor is operated with two sets of circuits, a first circuit for meas…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.