Heat dissipation apparatus
US7537049B2 · kind B2 · utility
5Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2006 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Oct 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus (10) includes a computer enclosure (110) made of thermally conductive material, a fin assembly (140) secured to the computer enclosure, and a heat pipe (130) having an evaporating section (131) thermally connecting with a heat generating electronic component and a condensing section (132) thermally connecting with the fin assembly. The fin assembly has a bottom surface contacting with a chassis of the enclosure to thereby transfer heat from the fin assembly to the chassis for dissipation. The enclosure forms a pair of clamping members (111) clamping the fin assembly therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.