Method of making multi-chip package with high-speed serial communications between semiconductor dice
US7537960B2 · kind B2 · utility
2Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2008 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Jan 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.