Semiconductor chip assembly with bumped terminal, filler and insulative base
US7538415B1 · kind B1 · utility
52Cited by
174References
100Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2007 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Dec 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3651
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the bumped terminal and the filler and extends laterally beyond the bumped terminal and the filler, the filler contacts the bumped terminal in a cavity that extends into the bumped terminal, and the insulative base contacts the routing line and the bumped terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.