Integrated circuit micro-cooler having multi-layers of tubes of a CNT array
US7538422B2 · kind B2 · utility
19Cited by
61References
8Claims
0Family size
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Key dates
| Filing date | Sep 18, 2006 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Feb 3, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/762
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Heat sink structures employing multi-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In one embodiment, the nanotubes are cut to essentially the same length over the surface of the structure. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.