Power semiconductor package having integral fluid cooling
US7538425B2 · kind B2 · utility
50Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2004 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.