Copper interconnection with conductive polymer layer and method of forming the same
US7538434B2 · kind B2 · utility
13Cited by
23References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2005 |
| Grant date | May 26, 2009 |
| Priority date | — |
| Expiry date | Feb 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive polymer between two metallic layers acts a glue layer, a barrier layer or an activation seed layer. The conductive polymer layer is employed to encapsulate a copper interconnection structure to prevent copper diffusion into any overlying layers and improve adhesive characteristics between the copper and any overlying layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.