Sensor device
US7541574B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2007 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Jun 21, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.