Modularized device interface with grounding insert between two strips
US7541819B2 · kind B2 · utility
2Cited by
25References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2005 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Oct 28, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31905
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The traditional device interface board is replaced by a number of smaller strips containing one or more electrical components for interfacing the device under test and the test head. The device interface modules may mount to a stiffening member having a back bone and multiple ribs running through the stiffening member. The device interface strips can create a lattice-like structure for the interface circuitry. Individual circuits may be disposed on the interface strips to perform functionality relating to the device under test and/or the test head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.