Wafer laser processing method
US7544590B2 · kind B2 · utility
2Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 2007 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Aug 28, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of carrying out laser processing on a wafer having a plurality of parallel streets on the front surface along the streets, comprising the steps of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.