Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips
US7545035B2 · kind B2 · utility
0Cited by
8References
20Claims
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Inventor
Key dates
| Filing date | Nov 13, 2006 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Apr 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes several assembled integrated-circuit chips. A main integrated-circuit chip has at least one cavity in which electrical contacts are provided. A secondary integrated-circuit chip includes an edge which engages in the cavity of the main chip and has electrical contacts. When the secondary integrated-circuit chip is inserted into the cavity, the electrical contacts of the main chip and the electrical contacts of the secondary chip are placed so as to be in contact with one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.