Apparatus and method of inspecting the surface of a wafer

US7545489B2 · kind B2 · utility

Assignee

• Vistec Semiconductor Systems GmbH · DE

Inventors

• Wolfgang Sulik · Aßlar, DE
• Michael Heiden · Blieskastel, DE

Key dates

• Filing date: Aug 9, 2006
• Grant date: Jun 9, 2009
• Expiry date: May 10, 2027

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N21/9501
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An apparatus for inspecting a surface of a wafer includes an illumination device for illuminating an imaging area of the wafer with at least one broad-band spectrum, and an optical imaging device with a detector for polychromatic imaging of the imaging area of the wafer based on the illumination, wherein the imaging device includes a filter arrangement for selecting a plurality of narrow-band spectra. In addition, a method for inspecting the surface of a wafer, includes the steps of leveling a plurality of narrow-band spectra to a common intensity range, illuminating an imaging area of the wafer with at least one broad-band spectrum, and imaging a plurality of narrow-band spectra from the imaging area based on the illumination.