Automation of tie cell insertion, optimization and replacement by scan flip-flops to increase fault coverage
US7546568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2005 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Nov 30, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/392
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for designing an integrated circuit is disclosed. The method generally comprises the steps of (A) splitting a design layout of the integrated circuit into a plurality of tiles, (B) adding a plurality of tie-to cells to the design layout, wherein at least one of the tie-to cells generating a tie-to signal at a particular logical level is added into each of the tiles having at least one gate with an input fixed to the particular logical level and (C) routing the tie-to signal to each of the inputs within each of the tiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.