Packaging method of a light-sensing semiconductor device and packaging structure thereof
US7547571B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2008 |
| Grant date | Jun 16, 2009 |
| Priority date | — |
| Expiry date | Apr 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.