Patent · US Active

Package and package module of the package

US7547965B2 · kind B2 · utility

10Cited by
2References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 26, 2006
Grant dateJun 16, 2009
Priority date—
Expiry dateMar 16, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/351
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A package includes a carrier, a first chip, a first dielectric layer and at least one first connecting part. The carrier has a first surface and a second surface, and at least one first pad is disposed on the second surface. The first chip is disposed on the first surface. The first dielectric layer is disposed on the first surface and covers the first chip. The first connecting part is disposed in the first dielectric layer and disposed around an edge of the first chip to electrically connect the first chip with the first pad. A package module of the package is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.