Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for protecting copper interconnects
US7550046B2 · kind B2 · utility
3Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2007 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Oct 29, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76838
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of protecting an interconnect is provided. The method includes forming an integrated circuit structure having an interconnect, and depositing vaporized benzotriazole on the interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.