Thermal conductive material utilizing electrically conductive nanoparticles
US7550097B2 · kind B2 · utility
40Cited by
9References
26Claims
0Family size
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Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Apr 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.