Method for bonding substrates and device for bonding substrates
US7550366B2 · kind B2 · utility
12Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2005 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Dec 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.