Patent · US Active

Structure of package on package and method for fabricating the same

US7550836B2 · kind B2 · utility

117Cited by

1References

18Claims

0Family size

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

Che-Ya Chou
Chi-Tsung Chiu · Kaohsiung, TW

Key dates

Filing date	Aug 16, 2007
Grant date	Jun 23, 2009
Priority date	—
Expiry date	Aug 16, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A structure of a package on package and a method for fabricating the same are provided. The structure of the package on package includes a first package, a second package and a plurality of pins. The first package includes a first substrate and a first chip disposed thereon. The second package includes a second substrate and a second chip disposed thereon. The second package is disposed under the first package. The second package includes a plurality of holes. The pins are disposed on the first package and inserted to the holes so as to electrically connect the first package and the second package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.