Patent · US Expired

Method of fabricating a package for a micro component

US7553695B2 · kind B2 · utility

6Cited by

4References

16Claims

0Family size

Assignee

Hymite A/S · DK

Inventors

Lior Shiv · Yoqneam Illit, IL
Kristian Blidegn · Copenhagen, DK

Key dates

Filing date	Mar 17, 2005
Grant date	Jun 30, 2009
Priority date	—
Expiry date	Feb 28, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/01079
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch process. The package may include hermetically sealed feed-through electrical connections coupling the micro component to electrical contacts on an exterior surface of the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.