Integrating a heat spreader with an interface material having reduced void size
US7553702B2 · kind B2 · utility
2Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2007 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Sep 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1616
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated heat spreader and die coupled with solder are disclosed herein. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.