High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
US7554347B2 · kind B2 · utility
3Cited by
33References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2003 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jun 8, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Optoelectronic probe cards, methods of fabrication, and methods of use, are disclosed. Briefly described, one exemplary embodiment includes an optoelectronic probe card adapted to test an electrical quality and an optical quality of an optoelectronic structure under test having electrical and optical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.