Surface characteristic analysis
US7554654B2 · kind B2 · utility
10Cited by
77References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2007 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Nov 8, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9503
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a scatterometer to identify at least one defect region on the surface and a surface profile height measuring tool to measure one or more characteristics of the surface in the defect region with a surface profile height measuring tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.