System and method for carrying out liquid and subsequent drying treatments on one or more wafers
US7556697B2 · kind B2 · utility
0Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2004 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Feb 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems for processing microelectronic substrates in a process chamber that incorporate improved technology for transitioning from a wet process to a dry process (especially transitioning from rinsing to drying). At least a portion of residual liquid remaining in fluid supply lines after a wet treatment is removed via a pathway that avoids purging directly onto the substrates. Related methods are also included in the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.