Diffusion bonded fluid flow manifold with partially integrated inter-active component

US7559527B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Mark Crockett · Foster City, US
• John W. Lane · Austin, US
• Micahel DeChellis · Austin, US
• Chris Melcer · Sunnyvale, US
• Erica Porras · San Jose, US
• Aneesh Khullar · Sunnyvale, US
• Balarabe Mohammed · Union City, US

Key dates

• Filing date: Apr 19, 2007
• Grant date: Jul 14, 2009
• Expiry date: Apr 19, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49906
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.